Ogdensburg, NY 72,000 sq.ft.

Original Design Manufacturing (ODM)
SMT & PTH board assembly
Box-build, packaging
0201 & µBGA/CSP capabilities
Chip-on-Board / Wirebonding
Microelectronic & optoelectronic packaging specialists
Test & burn-in, test development
ICT on Genrad
Warranty & repair depot services
Component procurement
DFx consultation
Component engineering support
HALT/HASS support, FMEA
Class III, MILSPEC, NRC product support
Prototype to high volume
High-mix assembly
FDA Registered Facilities
ISO 13485:2003 Certified